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Hi Alex, If you have any questionis regarding Dreamus test report, we can discuss with ALT Mr.Yoon and Lonnie in this mantis ID 952. Thanks, Regards, Sean |
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Hi Mr.Yoon, Regarding the acoustic test, our acoustic team don't have DSIO module in AP side, Can we use to test 0dBFS of sweep sine(.wav file) instead of I2S. You can refer the page 3 of dreamus test report for more details. Thanks. Regards, Alex |
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Hi Lonnie, Please find attached for the microphone test report. As per I udpated in EVT test status excel, the sealing test result of MIC1 is not good. We have checked with our ME RD and suspected that the problem is due to the silicon rubber top do not fix well with microphone PCBA. Our ME RD is reworking the silicon rubber now, and we will debug this issue in our office this week. If we can fix this issue within this week, and I expected that we can verify the test again in Knowles's Lab. early of next week. Regards, Sean |
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Hi Lonnie, Can you ask Dreamus to provide us with limited power test result for each speakers? Please refer an example picture that we verified in other project as attached. We need to make sure that each speakers(woofer, mid-range, tweeter) reaches its maximum power when using 1KHz, 0dBFS audio sinewave playback. Thanks, Regards, Sean Limited power.jpg (158,877 bytes) |
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Hi Lonnie, Update the report for additional rubber test. Thank you. |
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Hi Lonnie, Sorry the attached file function seems wrong, upload a again. Thank you. |
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Dear Fu-chiang Young I think your test setup would be wrong. Microphone is located 1M from Speaker, but your pictures was very nearby(about 30cm?) Is you picture correct? Best regards Lonnie Kim |
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Hi Lonnie, Yes, the distance between MIC and SPK is 1M. That maybe camera lens issue to looks like very close. The vendor calibrates everytime before test. So the distance and every detail has been considered. Thank you. |
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@ (RD) Fu-chiang Young Could you please share your tested mockup photo? detail for MIC area in Korea have to test verify again and make dev sample for SKT (MIC Solution team). please send us. Thanks SON |
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Hi Fu-Chiang, Please support SH to provide the photo of our mockup as detail as possible. ALT inform us in the meeting today that they got the worse test result than ours. Thanks, Regards, Sean |
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2020-11-24 08:22 developer |
6.jpg (139,965 bytes) 1.jpg (166,738 bytes) 2.jpg (170,276 bytes) |
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Hi Mr. SH Son, Upload the pictures of top cover. Thank you. 3.jpg (185,723 bytes) 4.jpg (70,740 bytes) 5.jpg (106,409 bytes) |
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Hi Lonnie, Update the DVT sample test for MIC sealing. The rubber pad seems wrong with EVT build. The sealing is NG. We had tested with ME and has some suggestion. Please see attached files. Thank you. |
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Hi, Lonnie & SH, Please check the attached 3D data for MIC sealing suggestion. Thanks Jim |
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Hi Lonnie and SH, Hi SH, Update the mic sealing test results. Original we paste single adhesive between sponge mic rubber and mic PCB. But the test results cannot satisfy 25dB. We paste another adhesive between top cover and sponge mic rubber to strengthen sealing sensitivity. It seems the same results for top covers. It can duplicate. Please see the attached report. Thank you. |
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Hi SH Son, Can you ask INKEL to paste the adhesive on sponge_mic_rubber? It's difficult for our factory to paste this adhesive, which will lead to an increase in time and labor costs. Thanks Jim |
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Hi Fu-chiang Young Can you show me how to attach the adhesive between sponge mic rubber? The sealing performance is affected by the attachment method. Hi Jim Chen I will check with vender, but it is really hard to paste the adhesive on sponge_mic_rubber. because It is a very thin and stretchable material, so it cannot be attached. Thanks SON |
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Hi SH, Please see the picture 1, adhesive1 and adhesive2 which both adhesive are pasted on sponge mic rubber. Please see attached file, too. Thank you. picture 1.png (246,569 bytes) |
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Hi SH, Please see the attached picture, which is top cover pasted the adhesive before assembly sponge mic rubber. This picture is also put into report. Thank you. adhesive on top cover.jpeg (152,341 bytes) |
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HI Fu-chiang Young I want to check adhesive between sponge mic rubber and Mic pcba. Please refer to the attachment file and let me know. Thanks SON |
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Hi Jim reply 0000952:0007782 that's structurally impossible I think that the adhesive should be attachment PCB side first because, the sponge_mic_rubber is made by silicon. and has silicon oil. The adhesive doesn't stick and can not remove protective film because of the silicone oil Please review the make a JIG for easy attachment with factory manufacturing engineer. if you need any questions, please tell me. I can help it. Thanks SON Thanks SON KakaoTalk_20210806_164242141.jpg (112,766 bytes) |
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Hi Sean. Here is mic sealing test report. I did pretest at the NSSC. the NSSC is certified testing laboratory in Korea. also final acoustic certification laboratory for SWAN project. All measurement conditions and environment are meet the SKT requirements. as I know that FII test conditions, the measuring distance was shortened due to 94dbSPL I tested FII solution 0000952:0007781 Yes, it has a -25db margin but I can not accept FII solution because - With an increase of 0.2t, external deformation occurred - Measurement values for each microphone are not consistent. as a result, the sealing solution to finish as attachment This specification will be discussed with Inkel and FII. Thank SON DUBBLE TAPE_HOLDER MIC_210806.dwg (197,412 bytes) |
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Hi SH, 0000952:0007825 Can INKEL provide this adhesive? And please request INKEL to paste this adhesive on holder after Per-MP. Too many materials need to be assembled in our factory, and it will take a lot of manpower. Thanks Jim |
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Hi Jim 0000952:0007831 first of all,Yes. first MP (1K) need to paste adhesive on holder at the factory. and sub assembly for the paste adhesive on holder, ALT is discuss with vender. I will let you know that Thanks SON |
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The SWAN already entered the MP stage. There is no further action needed for this issue. So, we close this mantis issue. Thanks! |
- yk.jung ( (ALTech) Younkwang Jung ) developer
